Heat dissipation analysis of high power LED package

Abstract

With the increasing output power of LED chip, heat dissipation analysis and design of high-power LED has become one of the key technologies of LED packaging. In this paper, the three-dimensional packaging model of high-power LED is established. The finite element method is used to simulate the temperature field distribution of LED. The influence of bonding material and substrate thickness on the heat dissipation of LED package is analyzed by changing the relevant parameters of LED package, and this method has a certain guiding significance on optimizing the LED package.