Warpage Prediction and Lifetime Analysis for Large Size Through-silicon-via (TSV) Interposer Package

Abstract

In the study, warpage as a serious problem need to be investigated for large size TSV interposer package technology. The most important task for TSV interposer package is to discuss the warpage influence on some critical assembly processes. In the paper, two kinds of assembly processes were described in detail: one is based on strip-level assembly processes, the other is based on individual package-level one. By using finite element method, warpage simulation results were analyzed for TSV interposer attach, die attach, stiffener attach, etc. Besides, board-level lifetime prediction under the harsh TC condition (−65 °C ~ 150 °C) was investigated in the study based on Darveaux’s model of strain energy density.