New method to study unlanded via architecture. Application to advanced interconnects: Al with low k and copper dual damascene

Abstract

This paper describes a new test structure developed to study unlanded vias. The limitation of conventional chains to characterize vias is shown. The new structures enabled us to improve product yield in a 0.18 /spl mu/m technology using HSQ and aluminum interconnects. Finally, it is emphasized that it is very useful to compare different copper dual damascene architectures.