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Cavity packages for volume MEMS applications

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2012-11-01 DOI:10.1109/IEMT.2012.6521801
A. Evans
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用于批量MEMS应用的空腔封装
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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来源期刊
2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)
2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)
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