Silicon Optical Electrical Interposer - Fiber to the Chip

Abstract

A Silicon Optical Interposer for 2.5D integration of high speed electrical and optical circuit is proposed here. The Si Interposer functions as a base substrate for the optical alignment of the Photonic IC and the fibers which are held in a Si Fiber Block or can be integrated directly. The alignment scheme is semi passive, it utilizes a set of U-grooves with submicron accuracy and the cylindrical face of a pair of precision pin for the self-alignment. The Photonic IC and the Fiber Block are faced down assembled on the Si Interposer. Electrical connections are made using the flip chip micro bumps between the Photonic IC and the Si Interposer. The number of channel in this proposed design is scalable and is applicable for high speed optical transceiver design.