Advanced power copper technology for SMARTMOS/sup TM/ application designs

12th International Symposium on Power Semiconductor Devices & ICs. Proceedings (Cat. No.00CH37094) Pub Date : 2000-05-22 DOI:10.1109/ISPSD.2000.856791

I. Pagès, B. Baird, J. Wang, T. Sicard, J. Dorkel, P. Dupuy, P. Lance, E. Huynh, Y. Chung

引用次数: 4

Abstract

Cost effective automotive applications and the related circuit designs are requiring new SMARTMOS/sup TM/ technology extensions to manage energy capability and metal debiasing in smart power devices. A thick copper metallization scheme, POWER COPPER, has been integrated and characterized in the circuit design of two electronic modules for automotive applications.

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先进的电源铜技术，用于SMARTMOS/sup TM/应用设计

具有成本效益的汽车应用和相关电路设计需要新的SMARTMOS/sup TM/技术扩展来管理智能电源器件中的能量能力和金属去偏。厚铜金属化方案POWER copper在两个汽车电子模块的电路设计中得到了集成和表征。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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12th International Symposium on Power Semiconductor Devices & ICs. Proceedings (Cat. No.00CH37094)

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