{"title":"iProbe-d: a hot-carrier and oxide reliability simulator","authors":"Ping-Chung Li, G. Stamoulis, I. Hajj","doi":"10.1109/RELPHY.1994.307824","DOIUrl":null,"url":null,"abstract":"In this paper we describe a hot-carrier and oxide reliability simulator, iProbe-d. In this program, a probabilistic timing approach is employed to find the most susceptible devices to hot-carrier degradation and/or oxide breakdown in a CMOS VLSI digital circuit design under expected operating conditions. After the damage in each device is determined, a combination of damaged-transistor model, RC delay and critical path analysis is used to estimate the impact of hot-carrier effects (HCE) on circuit performance; namely, the increase of circuit delay. The results can then be used to improve the reliability of the circuit prior to fabrication.<<ETX>>","PeriodicalId":276224,"journal":{"name":"Proceedings of 1994 IEEE International Reliability Physics Symposium","volume":"58 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"17","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1994 IEEE International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1994.307824","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 17
Abstract
In this paper we describe a hot-carrier and oxide reliability simulator, iProbe-d. In this program, a probabilistic timing approach is employed to find the most susceptible devices to hot-carrier degradation and/or oxide breakdown in a CMOS VLSI digital circuit design under expected operating conditions. After the damage in each device is determined, a combination of damaged-transistor model, RC delay and critical path analysis is used to estimate the impact of hot-carrier effects (HCE) on circuit performance; namely, the increase of circuit delay. The results can then be used to improve the reliability of the circuit prior to fabrication.<>