Thermal management of high performance test socket for wafer level package

Abstract

High performance test sockets with thermal management solutions have been developed for wafer level package of high power. Three types of active cooling solutions have been designed and integrated in the test socket. Type A of more compact size can be easily assembled in the space limited environment. Type B is much larger and more complex, including 4 direct touch copper heat pipes. Type C comprises of direct contact liquid cooler for chip heat delivery and outside exchanger for heat rejection to the environment. To maintain the maximum chip temperature under 85°C, the heating power of around 80W and 120W can be dissipated with type A and type B respectively. With Type C, the dissipated heating power can be as high as 150W. Appropriate management of test socket thermal issue will assure the success for high performance test of advanced packages.