Investigation of ultra thin polycrystalline silicon channel for vertical NAND flash

Bio Kim, Seung-Hyun Lim, Dong Woo Kim, T. Nakanishi, S. Yang, Jae-young Ahn, Hanmei Choi, K. Hwang, Yong-Deuk Ko, C. Kang
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引用次数: 22

Abstract

We have investigated thin film transistors (TFTs) with ultra-thin polycrystalline silicon (poly-Si) of 77 Å – 185 Å. The TFT charge transfer characteristics such as ON current and effective mobility are dominated not by the thickness itself but by the grain size of poly-Si channel. When the poly-Si channel thickness is decreased with the same grain size, the sub-threshold TFT characteristics are improved without degradation of ON current and reliability properties. These results give us appropriate criteria to establish an excellent poly-Si channel in vertical NAND flash memory.
垂直NAND闪存用超薄多晶硅通道的研究
我们研究了超薄多晶硅(poly-Si)为77 Å - 185 Å的薄膜晶体管(TFTs)。TFT电荷转移特性如ON电流和有效迁移率不是由多晶硅沟道的厚度决定的,而是由多晶硅沟道的晶粒尺寸决定的。当多晶硅沟道厚度减小而晶粒尺寸不变时,亚阈值TFT特性得到改善,且不影响导通电流和可靠性。这些结果为我们在垂直NAND快闪记忆体中建立优良的多晶硅通道提供了适当的标准。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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