Accurate, predictive modeling of soft error rate due to cosmic rays and chip alpha radiation

G. Srinivasan, P. Murley, H.H.K. Tang
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引用次数: 120

Abstract

We report here the development of a unique and comprehensive computer program (SEMM) to calculate the probability of soft fails in integrated circuits due to alpha particles emanating from the chip materials and due to terrestrial cosmic rays. This model treats all failure modes on an event by event basis allowing for all nuclear reactions and pulse shape effects. It is a three-dimensional design tool that takes the detailed chip layout and profile information to compute the soft error rate and is used without any parameter fitting. SEMM has been extensively tested with hot sources, high energy proton beams, and high elevation cosmic ray tests. Applications of SEMM to bipolar and CMOS chips and considerations for building in reliability for radiation induced soft fails are also discussed.<>
由于宇宙射线和芯片α辐射的软错误率的准确,预测建模
我们在此报告了一种独特而全面的计算机程序(SEMM)的发展,以计算由于芯片材料发出的α粒子和由于地球宇宙射线而导致集成电路软故障的概率。该模型在考虑所有核反应和脉冲形状效应的基础上逐个处理所有失效模式。它是一种采用详细的芯片布局和轮廓信息来计算软错误率的三维设计工具,不需要任何参数拟合。SEMM已通过热源、高能质子束和高海拔宇宙射线测试进行了广泛的测试。还讨论了SEMM在双极和CMOS芯片上的应用,以及在辐射诱发软故障时建立可靠性的考虑。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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