Study on reliability test of die attach material

Lim Chuan Yik, Y. B. Kar, N. Shafika
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引用次数: 1

Abstract

Silver plated copper is a new developed die attachment material to replace pure silver. As year past, price of silver getting higher and become a problem for those semiconductors packaging company. Therefore, silver plated copper was developed as new die attachment material to solve the costing problem. But the characteristic and reliability of silver plated copper filler has be a doubt to replace the pure silver in the market. This paper will review few test method to test on the reliability of silver plated copper filler and proved that it is as good as silver to be the filler.
模具附着材料可靠性试验研究
镀银铜是一种新开发的代替纯银的模具附件材料。近年来,银价不断上涨,成为半导体封装企业的一大难题。因此,开发镀银铜作为新型的模具附件材料来解决成本问题。但镀银铜填料的特性和可靠性一直是市场上替代纯银的一个疑问。本文综述了几种测试镀银铜填料可靠性的方法,证明了镀银铜填料的可靠性与镀银一样好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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