3D TSV and interposer

J. W. Fraunhofer
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Abstract

3D System Integration is one of the most significant strategic key technologies in the field of microelectronic packaging and System integration. Besides the progress in silicon technology following “Moore's law” there is an increasing demand for highly miniaturized complex system architectures which are based on 3D SiPs. Currently different approaches are in development, which will result in complex 3D stacking approaches using TSV technology. Silicon interposer with TSV are one important element to combine different advanced devices into one miniaturized system with high functionality. The main target today is to achieve cost reduction in TSV processing and stack assembly. But nevertheless 3D WL approaches technology is one of the main technology drivers in packaging and system integration. The presentation will highlight same major aspects and current status of this technology.
3D TSV和中介器
三维系统集成是微电子封装和系统集成领域最重要的战略关键技术之一。除了遵循“摩尔定律”的硅技术的进步之外,对基于3D sip的高度小型化复杂系统架构的需求也在不断增加。目前不同的方法正在开发中,这将导致使用TSV技术的复杂3D叠加方法。集成TSV的硅中间层是将不同的先进器件集成到一个高功能的小型化系统中的重要元件。目前的主要目标是降低TSV加工和堆叠组装的成本。然而,3D WL方法技术是封装和系统集成的主要技术驱动因素之一。该演讲将强调该技术的主要方面和现状。
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