Design and simulation of SIP for RF system

Abstract

With the scaling of CMOS, the system-on-chip (SOC) has become a viable option for RF system. The absence of high Q inductors for CMOS RF has led to an appearance of RF system-in-package. In this paper, we analyze the merit of the package for CMOS RF IC and review development of the package. We focus on LTCC technology and simulate a high performance mixer using stacked spiral inductor.