{"title":"Novel method for debug of electrostatic discharge protection in VLSI circuits","authors":"S. Sofer, Y. Fefer, M. Borenshtein, Y. Shapira","doi":"10.1109/IPFA.2006.251043","DOIUrl":null,"url":null,"abstract":"A proposed method for failure analysis and debugging of electrostatic discharge protection in VLSI circuits is presented, based on low-energy non-destructive emulation of real ESD stress. It allows on-die current and voltage measurements during stress, providing a direct and clear conclusion about the proper functioning of the protection method, or a reason for failure","PeriodicalId":283576,"journal":{"name":"2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"98 4","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-07-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2006.251043","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
A proposed method for failure analysis and debugging of electrostatic discharge protection in VLSI circuits is presented, based on low-energy non-destructive emulation of real ESD stress. It allows on-die current and voltage measurements during stress, providing a direct and clear conclusion about the proper functioning of the protection method, or a reason for failure