Influence of package lead type onto final test contacting

Abstract

As per the requirements of the market, current semiconductor trend is towards shrinking packages thereby reducing package dimensions. This in turn results in reduced lead pitch and width giving less space for contacting during final testing. Another trend recently observed for the package lead is the shift from matteSn plating towards preplated leadframes or otherwise called uPPF. When it comes to power testing requirements like kelvin testing that needs to have two contacts on single lead this shift is a challenge for contacting. This paper discusses in detail the observations of the difference in the material interaction between pin and the two different leadframes at constant current flowing through the pin.