On the Physics of Failure in the Case of Moisture Induced Delamination in Plastic Encapsulated Microelectronic Devices

Abstract

By identifying the moisture concentration at the weakest material interface as the critical parameter for the defect onset, the quantitative prediction of moisture induced delamination between molding compound and die surface in plastic packages was realized. As a result, the delamination onset during multiple soak and reflow procedure, as prescribed by customers' specifications, was predicted from the IPC/JEDEC J-STD-020C moisture sensitivity level.