A New Cyclic Biased T.H.B. Test for Power Dissipating IC's

Abstract

As a test method for moisture resistance, conventional T.H.B. (Temperature, Humidity, Bias) Test is being widely used. However, in testing integrated circuits especially linear circuits, it is extremely difficult to put all of the circuit elements under reverse bias cutoff conditions. The T.H.B. Test is usually performed under an actual operating condition. As a result, the junction temperature increases due to a large power dissipation, and the humidity level in the devices decreases. Consequently, the test is not considered to be conducted under the intended high humidity condition. For that reason, the conventional T.H.B. Test is not thought to be a proper test method for integrated circuits*