Neutral base recombination in advanced SiGe HBTs and its impact on the temperature characteristics of precision analog circuits

A. Joseph, J. Cressler, R. Jaeger, D. M. Richey, D. Harame
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引用次数: 10

Abstract

We present the first comprehensive investigation of neutral base recombination (NBR) in advanced UHV/CVD SiGe HBTs, and quantitatively assess its impact on the temperature characteristics of precision analog circuits. We show that a direct consequence of NBR in SiGe HBT's is the degradation of Early voltage (V/sub A/) when transistors are operated with constant current input (forced-I/sub B/). We quantitatively address the impact of NBR on precision SiGe analog circuits by incorporating the effect into a new version of SPICE, calibrating the SPICE models to data, and simulating different types of precision current sources across the temperature range of -55/spl deg/C to 85/spl deg/C.
高级SiGe hbt中性点基极重组及其对精密模拟电路温度特性的影响
本文首次全面研究了中性点基极复合(NBR)在先进的UHV/CVD SiGe hbt中的应用,并定量评估了其对精密模拟电路温度特性的影响。我们表明,在SiGe HBT中,NBR的直接后果是当晶体管在恒流输入(强制i /sub B/)下工作时,早期电压(V/sub a /)的退化。我们通过将NBR对精密SiGe模拟电路的影响纳入新版本的SPICE,将SPICE模型校准为数据,并在-55/spl°C至85/spl°C的温度范围内模拟不同类型的精密电流源,定量地解决了NBR对精密SiGe模拟电路的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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