Dbc (direct bond copper) substrate with integrated flat heat pipe

Abstract

A novel heat pipe design was developed consisting or a ceramic substrate sandwich with integrated flat heat pipe. On both sides of the heat pipe active electronic components, such as IGBT's or MOSFET's, can be mounted on an etched copper circuit. Heat densities over 80 W/cm2 can be dissipated easily. The functionality is independent of the working position either horizontal or vertical. The heat pipe can be used to an internal pressure over 7 bars without cracking the ceramic substrate. All requirements for space applications could be fulfilled. First application is foreseen for cooling DC-DC converters in satellites