S. Toh, Z. Mai, P. K. Tan, E. Hendarto, H. Tan, Q.F. Wang, J.L. Cai, Q. Deng, T. H. Ng, Y. W. Goh, J. Lam, L. Hsia
{"title":"Use of Nanoprobing as the Diagnostic Tool for Nanoscaled Devices","authors":"S. Toh, Z. Mai, P. K. Tan, E. Hendarto, H. Tan, Q.F. Wang, J.L. Cai, Q. Deng, T. H. Ng, Y. W. Goh, J. Lam, L. Hsia","doi":"10.1109/IPFA.2007.4378057","DOIUrl":null,"url":null,"abstract":"Nanoprobing plays a crucial role for failure analysis (FA) in the nanometer-region generation nodes by having the capability to detect the failure sites and characterize the electrical behaviour of malfunctional devices for better understanding of the failure mechanisms. It also offers a guide to the necessary physical analysis in identifying the cause of failure. This established electrical failure analysis (EFA) methodology at a localized area helps to accelerate the FA. Its application to few of the front-end issues is highlighted in the paper.","PeriodicalId":334987,"journal":{"name":"2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2007.4378057","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9
Abstract
Nanoprobing plays a crucial role for failure analysis (FA) in the nanometer-region generation nodes by having the capability to detect the failure sites and characterize the electrical behaviour of malfunctional devices for better understanding of the failure mechanisms. It also offers a guide to the necessary physical analysis in identifying the cause of failure. This established electrical failure analysis (EFA) methodology at a localized area helps to accelerate the FA. Its application to few of the front-end issues is highlighted in the paper.