Bus Snubber Optimization for Multi-Chip Power Modules using SPICE Simulations

Brian T. DeBoi, A. Lemmon
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Abstract

Bus snubbers are a commonly used mechanism for improving the switching performance of circuits using wide bandgap devices. Particularly, their influence on switching losses and transient overshoot is of interest. However, bus snubbers can have multiple effects on these behaviors, resulting in a series of tradeoffs. Understanding the tradeoffs associated with bus snubber design can assist in selecting an optimal value for a given system, but determining this optimal value empirically is challenging and time consuming. As such, this paper leverages a SPICE simulation model of a multi-chip power module and accompanying application circuit to analyze these trends. This simulation model is empirically validated with a set of experiments performed on a double pulse test stand. The resulting analysis demonstrates that the presented SPICE model can facilitate the selection of an optimal bus capacitor, thereby reducing the need for empirical analysis. The effect of additional resistance in the snubber circuit is also analyzed empirically, revealing further tradeoffs to be considered for snubber design.
基于SPICE仿真的多芯片电源模块总线缓冲器优化
总线缓冲器是一种常用的机制,用于改善使用宽带隙器件的电路的开关性能。特别是,它们对开关损耗和瞬态超调的影响令人感兴趣。然而,公交车怠慢会对这些行为产生多重影响,导致一系列权衡。了解与总线缓冲设计相关的权衡可以帮助为给定系统选择最优值,但是根据经验确定这个最优值是具有挑战性和耗时的。因此,本文利用多芯片电源模块的SPICE仿真模型和相应的应用电路来分析这些趋势。在双脉冲试验台上进行了一组实验,验证了该仿真模型的有效性。分析结果表明,所提出的SPICE模型可以方便地选择最优的母线电容,从而减少了实证分析的需要。在缓冲器电路中附加电阻的影响也进行了经验分析,揭示了进一步的权衡要考虑缓冲器设计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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