Combined temperature and current stressing of MOVPE-grown GaAs/InGaP HBTs

Joachim Wirfl, P. Kurpas, F. Brunner, M. Mai, T. Bergunde, T. Spitzbart, M. Weyers
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Abstract

HBTs for numerous applications increasingly penetrate the market thus placing significant pressure towards the development of highly reliable devices. MOVPE grown InGaP/GaAs-HBTs have recently shown their great potential by demonstrating remarkable reliability values. This paper focuses on the gradual and sudden degradation of InGaP/GaAs HBT DC-parameters during combined thermal and electrical lifetime testing. The tests have been performed on GaInP/GaAs HBTs developed for highly efficient microwave power amplifiers.
movpe生长GaAs/InGaP HBTs的复合温度和电流应力
用于众多应用的hbt日益渗透市场,从而对高可靠性设备的开发施加了巨大压力。最近,InGaP/GaAs-HBTs通过展示卓越的可靠性价值,显示了其巨大的潜力。本文重点研究了InGaP/GaAs HBT直流参数在热电寿命联合测试过程中的逐渐退化和突然退化。在用于高效微波功率放大器的GaInP/GaAs HBTs上进行了测试。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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