Mechanism analyses on PBGA strip packaging warpage

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI:10.1109/ESIME.2010.5464527

Yeong-Kook Kim, In Soo Park, Jooho Choi, J. Gang

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引用次数: 3

Abstract

The objective of this study is to analyze warpage development mechanism by simulating a strip type packaging for plastic ball grid array. Molding compound and substrate materials were thermo-mechanically tested to obtain the mechanical properties by several test methods. Samples were fabricated using the same materials, and warpage developments were measured at room temperature after molding compound cure. The results were compared with the measurement data of the samples, and the warpage mechanism was investigated based on the elastic and viscoelastic simulation results. The development mechanism was analyzed through the simulation calculations by combining different material properties modeling and geometries. It was found that the relaxation behaviors of the molding compound and the substrate materials, and the packaging geometry had significant effects on the warpage development. The development mechanism was comprehensively discussed based on the results.

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PBGA带材包装翘曲机理分析

通过对塑料球栅阵列的条形包装进行模拟，分析其翘曲发展机理。采用多种测试方法对成型复合材料和基材进行热力学测试，获得其力学性能。使用相同的材料制作样品，并在室温下测量成型复合固化后的翘曲发展。将结果与样品的实测数据进行对比，并基于弹性和粘弹性模拟结果对翘曲机理进行了研究。结合不同材料特性建模和几何图形，通过仿真计算分析了其发展机理。研究发现，成型材料和衬底材料的松弛行为以及封装几何形状对翘曲发展有显著影响。在此基础上，对其发展机制进行了全面探讨。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)

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