Harm Dillen, D. Oorschot, M. Kooiman, Willem van Mierlo, Ziyang Wang, Kang-san Lee, Jin-Woo Lee, Ruochong Fei, Shu-yu Lai, M. Kea, Inhwan Lee, Hwan Kim, Jung-hyun Kang, Jaehee Hwang, Chang-moon Lim
{"title":"Massive metrology and failure identification for DRAM applications (Conference Presentation)","authors":"Harm Dillen, D. Oorschot, M. Kooiman, Willem van Mierlo, Ziyang Wang, Kang-san Lee, Jin-Woo Lee, Ruochong Fei, Shu-yu Lai, M. Kea, Inhwan Lee, Hwan Kim, Jung-hyun Kang, Jaehee Hwang, Chang-moon Lim","doi":"10.1117/12.2515487","DOIUrl":null,"url":null,"abstract":"Introduction and problem statement\nGiven that EUV lithography allows printing smaller Critical Dimension (CD) features, it can result in non-normal distributed CD populations on ADI wafers [Civay SPIE AL 2014], leading to errors in predicted failure rates [Bristol SPIE AL 2017]. As a result, there is a need to quantify the actual behavior of the CD population extremes by means of massive metrology [Dillen EUVL 2018]. Not only allows this to study the CD distribution, we can in parallel also evaluate pattern quality and the failure mechanisms leading to defects. This massive metrology method provides an accurate failure rate based on CD, and enables new possibilities to define a failure rate based on different metrics in a single measurement.\n\nMethod \nWe analyze the CD uniformity of pillars in polar coordinates using a global waveform based thresholding strategy. In conjunction with this CD information, we also evaluated the print quality of each individual measured feature. \nFig 1. In line detected anomalies and failure definitions\n\nAs we gather this information during the measurement of CD, we can limit the additional measurement overhead to neglectable levels.\n\nApplication and outlook\nWe will show how we can leverage this to determine a defect based process window and relations of failure mechanisms through process conditions (see figure 2). When we take failures in a CH dataset into account, we illustrate the effect on the shape of a large dataset distribution in figure 3. \nFig 2. Defect identification for a through exposure dose experiment of pillars. For each condition >13k pillars where measured. The plot clearly shows an asymmetric behavior due to different failure mechanisms at low and high energy. The 2 vertical lines at relative energies 0.93 and 1.05 times nominal indicate the low defect process window.\n \nFig 3. A distribution of measured regular grid dense CH. The red line is the unfiltered CD data, the blue line is the shape of the distribution after filtering individual CH measurements that have a much lower contrast than expected.","PeriodicalId":331248,"journal":{"name":"Metrology, Inspection, and Process Control for Microlithography XXXIII","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Metrology, Inspection, and Process Control for Microlithography XXXIII","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.2515487","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Introduction and problem statement
Given that EUV lithography allows printing smaller Critical Dimension (CD) features, it can result in non-normal distributed CD populations on ADI wafers [Civay SPIE AL 2014], leading to errors in predicted failure rates [Bristol SPIE AL 2017]. As a result, there is a need to quantify the actual behavior of the CD population extremes by means of massive metrology [Dillen EUVL 2018]. Not only allows this to study the CD distribution, we can in parallel also evaluate pattern quality and the failure mechanisms leading to defects. This massive metrology method provides an accurate failure rate based on CD, and enables new possibilities to define a failure rate based on different metrics in a single measurement.
Method
We analyze the CD uniformity of pillars in polar coordinates using a global waveform based thresholding strategy. In conjunction with this CD information, we also evaluated the print quality of each individual measured feature.
Fig 1. In line detected anomalies and failure definitions
As we gather this information during the measurement of CD, we can limit the additional measurement overhead to neglectable levels.
Application and outlook
We will show how we can leverage this to determine a defect based process window and relations of failure mechanisms through process conditions (see figure 2). When we take failures in a CH dataset into account, we illustrate the effect on the shape of a large dataset distribution in figure 3.
Fig 2. Defect identification for a through exposure dose experiment of pillars. For each condition >13k pillars where measured. The plot clearly shows an asymmetric behavior due to different failure mechanisms at low and high energy. The 2 vertical lines at relative energies 0.93 and 1.05 times nominal indicate the low defect process window.
Fig 3. A distribution of measured regular grid dense CH. The red line is the unfiltered CD data, the blue line is the shape of the distribution after filtering individual CH measurements that have a much lower contrast than expected.
由于EUV光刻允许打印更小的临界尺寸(CD)特征,它可能导致ADI晶圆上非正态分布的CD人口[Civay SPIE AL 2014],导致预测失败率的错误[Bristol SPIE AL 2017]。因此,有必要通过大规模计量来量化CD种群极端的实际行为[Dillen EUVL 2018]。不仅允许研究CD分布,我们还可以并行地评估模式质量和导致缺陷的失效机制。这种大规模的计量方法提供了基于CD的精确故障率,并使在单个测量中基于不同度量来定义故障率成为可能。方法采用一种基于全局波形的阈值策略,在极坐标下分析柱的CD均匀性。结合这些CD信息,我们还评估了每个单独测量特征的打印质量。图1所示。在检测到的异常和故障定义中,如果我们在CD测量期间收集这些信息,我们可以将额外的测量开销限制在可以忽略的水平。我们将展示如何利用这一点来确定基于缺陷的过程窗口和通过过程条件的失效机制的关系(参见图2)。当我们考虑CH数据集中的故障时,我们在图3中说明了对大型数据集分布形状的影响。图2所示。矿柱透照剂量试验缺陷识别。在每种情况下,测量了13k根柱子。该图清楚地显示了由于低能和高能破坏机制不同而导致的不对称行为。相对能量为0.93倍和1.05倍的两条垂直线表示低缺陷过程窗口。图3所示。测量到的规则网格密集碳水化合物的分布。红线是未过滤的CD数据,蓝线是过滤单个碳水化合物测量值后的分布形状,这些测量值的对比度远低于预期。