Closing the gap between ASIC and full custom: a path to quality design

M. Reinhardt
{"title":"Closing the gap between ASIC and full custom: a path to quality design","authors":"M. Reinhardt","doi":"10.1109/ISQED.2003.1194741","DOIUrl":null,"url":null,"abstract":"Although process technology has shrunk down to nanometer features over the last decade, the gap between ASIC design and full-custom IC design has widened. This gap includes significant differences in performance, price, and profit between the two design styles. It is also revealed by huge differences in quality between the two styles in speed, power distribution and consumption, yield, and reliability, in some cases as much as an order of magnitude. To fully utilize the latest process technologies, a full-custom design approach with the productivity of an ASIC flow is necessary. Michael Reinhardt will start with an analysis of how the gap between ASIC and full-custom design began, and discuss its long-term consequences on the whole industry. He will then show the positive effects on the quality of IC design, and on the chip industry’s economic situation, which can occur if this gap can be closed. He will illustrate possible strategies and solutions for achieving this closure, and how they can be implemented right now in practical ways.","PeriodicalId":448890,"journal":{"name":"Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.","volume":"94 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED.2003.1194741","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

Although process technology has shrunk down to nanometer features over the last decade, the gap between ASIC design and full-custom IC design has widened. This gap includes significant differences in performance, price, and profit between the two design styles. It is also revealed by huge differences in quality between the two styles in speed, power distribution and consumption, yield, and reliability, in some cases as much as an order of magnitude. To fully utilize the latest process technologies, a full-custom design approach with the productivity of an ASIC flow is necessary. Michael Reinhardt will start with an analysis of how the gap between ASIC and full-custom design began, and discuss its long-term consequences on the whole industry. He will then show the positive effects on the quality of IC design, and on the chip industry’s economic situation, which can occur if this gap can be closed. He will illustrate possible strategies and solutions for achieving this closure, and how they can be implemented right now in practical ways.
缩小ASIC和完全定制之间的差距:通往高质量设计的道路
虽然在过去的十年中,工艺技术已经缩小到纳米级,但ASIC设计和全定制IC设计之间的差距已经扩大。这一差距包括两种设计风格在性能、价格和利润上的显著差异。两种风格在速度、功率分配和消耗、产量和可靠性方面的巨大质量差异也揭示了这一点,在某些情况下甚至达到了一个数量级。为了充分利用最新的工艺技术,必须采用具有ASIC流程生产力的完全定制设计方法。Michael Reinhardt将首先分析ASIC和完全定制设计之间的差距是如何开始的,并讨论其对整个行业的长期影响。然后,他将展示如果能够缩小这一差距,将对IC设计质量和芯片行业经济状况产生的积极影响。他将阐述实现这种封闭的可能策略和解决方案,以及如何以实际的方式实施它们。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信