New method for electrothermal simulations: HDTMOS in automotive applications

Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) Pub Date : 2004-03-09 DOI:10.1109/STHERM.2004.1291310

P. Tounsi, J. Dorkel, P. Dupuy, X. Chauffleur, J. Fradin, A. Feybesse, F. Chaunut

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引用次数: 13

Abstract

In this paper, an original method for electrothermal simulation is presented. This method is intended for automotive applications where an HDTMOS/spl trade/-driven electronic actuator operates at a high switching frequency (20kHz). First, a SPICE electrical model of the switching cell is developed. The temperature-dependent intrinsic electrical parameters are extracted with thermally-controlled electrical I-V measurements. Power dissipation is calculated from the duty cycle, /spl delta/, load current, I/sub M/, and the junction temperature T. The results, which are the power dissipation values for all combinations of (/spl delta/,I/sub M/,T), are used to fill in a look-up table. Then the HDTMOS structure (chip, packaging and heatsink) is described with the help of the REBECA-3D software package, and the electrothermal balance is found for given waveforms of current and duty cycle. The originality of this method lies in the effective way of processing the great difference of thermal and electrical time-constants in the procedure of communication between the two simulation programs.

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电热模拟的新方法:HDTMOS在汽车中的应用

本文提出了一种新颖的电热模拟方法。这种方法适用于汽车应用，其中HDTMOS/spl贸易/驱动的电子执行器在高开关频率(20kHz)下工作。首先，建立了开关电池的SPICE电学模型。通过热控电I-V测量提取温度相关的本征电参数。功耗由占空比、/spl δ /、负载电流、I/sub M/和结温T来计算。结果是(/spl δ /、I/sub M/、T)所有组合的功耗值，用于填写查找表。然后利用REBECA-3D软件包对HDTMOS的结构(芯片、封装和散热器)进行了描述，并对给定的电流和占空比波形进行了热平衡求解。该方法的独创性在于有效地处理了两个仿真程序通信过程中热电时间常数的巨大差异。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)

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