Reliability aspects of laser programmable redundancy: infrared vs. green, polysilicon vs. silicide

J. Chlipala, L. Scarfone
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引用次数: 5

Abstract

The laser explosion of memory redundancy target links has been simulated and temperature evolution profiles produced. The subsequent analysis suggests the following order starting with the most reliable: (1) polysilicon links with infrared laser; (2a) polysilicon links with green laser; (2b) silicide-polysilicon links with infrared laser; and (3) silicide-polysilicon links with green laser. Lower-melting point silicide (e.g. TiSi/sub 2/) is shown to hold some advantage over high-melting-point silicide (e.g. TaSi/sub 2/) as a target material. This advantage, however, is not enough to elevate it over polysilicon links in the reliability rank order.<>
激光可编程冗余的可靠性方面:红外与绿色,多晶硅与硅化物
模拟了存储器冗余目标链路的激光爆炸过程,得到了温度演化曲线。随后的分析表明,从最可靠的顺序开始:(1)多晶硅与红外激光器的链接;(2a)带有绿色激光的多晶硅链路;(2b)红外激光硅化物-多晶硅链接;(3)具有绿色激光的硅化物-多晶硅链接。作为靶材料,低熔点硅化物(如TiSi/sub 2/)比高熔点硅化物(如TaSi/sub 2/)具有一定的优势。然而,这一优势还不足以使其在可靠性等级上超过多晶硅链路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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