{"title":"PPB: Partially-working processors binning for maximizing wafer utilization","authors":"Da Cheng, S. Gupta","doi":"10.1109/VTS.2015.7116253","DOIUrl":null,"url":null,"abstract":"Hardware redundancy, such as spare processors and cores, has been added to chip multi-processors (CMPs) to improve yield while sustaining all functionalities of CMPs. During post-silicon testing, spares processors and cores are used for repair. Even after repair, some CMPs may have processors with insufficient number of cores; in such CMPs some processors are disabled and such chips are sold at lower prices to improve yield per area. Despite binning on the number of processors, substantial functional resources are wasted in disabled components. In this work, we propose a new utility function and a new repair algorithm which enable utilization of every working core on a CMP. We demonstrate the benefits of the proposed approach for benchmarks from ISPASS and Nvidia CUDA SDK using GPGPU-sim to compute the instructions per cycle (IPC). Results show that our design and repair approaches provide above 50% IPC per wafer area even with 10x the current defect density.","PeriodicalId":187545,"journal":{"name":"2015 IEEE 33rd VLSI Test Symposium (VTS)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE 33rd VLSI Test Symposium (VTS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VTS.2015.7116253","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Hardware redundancy, such as spare processors and cores, has been added to chip multi-processors (CMPs) to improve yield while sustaining all functionalities of CMPs. During post-silicon testing, spares processors and cores are used for repair. Even after repair, some CMPs may have processors with insufficient number of cores; in such CMPs some processors are disabled and such chips are sold at lower prices to improve yield per area. Despite binning on the number of processors, substantial functional resources are wasted in disabled components. In this work, we propose a new utility function and a new repair algorithm which enable utilization of every working core on a CMP. We demonstrate the benefits of the proposed approach for benchmarks from ISPASS and Nvidia CUDA SDK using GPGPU-sim to compute the instructions per cycle (IPC). Results show that our design and repair approaches provide above 50% IPC per wafer area even with 10x the current defect density.
硬件冗余,如备用处理器和核心,已经添加到芯片多处理器(cmp)中,以提高产量,同时保持cmp的所有功能。在硅后测试期间,备用处理器和核心用于修复。即使在修复之后,一些cmp的处理器可能内核数量不足;在这种cmp中,一些处理器被禁用,这样的芯片以较低的价格出售,以提高单位面积的产量。尽管减少了处理器的数量,但是大量的功能资源被浪费在被禁用的组件上。在这项工作中,我们提出了一种新的效用函数和一种新的修复算法,使CMP上的每个工作核心都能被利用。我们展示了使用GPGPU-sim卡计算每周期指令(IPC)的ISPASS和Nvidia CUDA SDK基准测试方法的好处。结果表明,我们的设计和修复方法即使在当前缺陷密度为10倍的情况下,每个晶圆面积也能提供50%以上的IPC。