Mobility modeling in presence of quantum effects

K. Dragosits, V. Palankovski, S. Selberherr
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引用次数: 2

Abstract

CMOS oxide thicknesses in the nanometer range lead to the development of TCAD models which take care of the quantum mechanical effects at the semiconductor/insulator interface. It is obvious that the quantum distribution of carriers will not fit to existing mobility models which were empirically developed employing a classical profile. Especially the terms which account for surface scattering need modifications. By utilizing an optimization framework and comparison with measurements stemming from overall 30 devices from two different technology nodes, this subject was rigorously investigated. Finally, a model was developed, where only one material parameter (instead of three) is needed to describe the semiconductor/oxide interface.
量子效应下的迁移率建模
纳米范围内的CMOS氧化物厚度导致TCAD模型的发展,该模型考虑了半导体/绝缘体界面上的量子力学效应。很明显,载流子的量子分布将不适合现有的利用经典剖面经验发展的迁移率模型。特别是考虑表面散射的条款需要修改。通过利用优化框架并与来自两个不同技术节点的30个设备的测量结果进行比较,对该主题进行了严格的研究。最后,开发了一个模型,其中只需要一个材料参数(而不是三个)来描述半导体/氧化物界面。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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