Ball shear versus ball pull test methods for evaluating interfacial failures in area array packages

27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium Pub Date : 2002-11-07 DOI:10.1109/IEMT.2002.1032754

R. Coyle, A. Serafino, P. Solan

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引用次数: 15

Abstract

In this investigation, a ball pull (tensile) test is investigated as an alternative to the ball shear test for evaluating the solder joint integrity of area array packages. The relative effectiveness of the pull and shear methods is compared using BGA packages with documented susceptibility to brittle interfacial failure during accelerated temperature cycling tests or isothermal aging. Accelerated temperature cycling is used typically to measure long term solder joint attachment reliability in various use environments and isothermal aging is used to measure susceptibility to degradation following high temperature storage. The shear and pull tests are conducted on packages in the as received condition and after thermal preconditioning. Metallographic failure analysis and scanning electron microscopy with energy dispersive X-ray analyses are used to characterize the solder joints and fracture modes. The ball shear and ball pull results are compared and discussed in terms of the ability to predict susceptibility to interfacial failures in area array packages.

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评估区域阵列封装中界面失效的球剪切与球拉力试验方法

在本研究中，研究了球拉(拉伸)试验作为球剪切试验的替代方案，用于评估区域阵列封装的焊点完整性。在加速温度循环试验或等温老化过程中，使用BGA封装对脆性界面破坏的敏感性进行了拉伸和剪切方法的相对有效性比较。加速温度循环通常用于测量各种使用环境下焊点连接的长期可靠性，等温老化用于测量高温储存后的降解敏感性。在收到的条件下和热预处理后，对包装进行剪切和拉伸试验。采用金相失效分析和扫描电子显微镜与能量色散x射线分析来表征焊点和断裂模式。在预测区域阵列封装中界面失效敏感性的能力方面，对球剪切和球拉结果进行了比较和讨论。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium

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