Keep on shrinking interconnect size: Is it still the best solution?

Denis Deschacht, S. D. Rivaz, Alexis Farcy, Thierry Lacrevaz, Bernard, Flechet
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引用次数: 14

Abstract

According to the evolution between each new technological generation of CMOS ICs, ITRS suggests a reduction in interconnect sizes by a factor of around square root of 2. In this paper a reference design rule is based on a perfectly controlled technology of the CMOS 45 nm node, with interconnects width equal to their separation space. Our works are focused on the impact on signal transmission speed and delay along interconnects of decreasing the space or width. To avoid new industrial manufacturing constraints on cost and reliability, this study is performed without modifying process and materials used in the BEOL of CMOS 45 nm IC. We will study interconnects of 50 nm width, with a 50 nm space between lines in accordance with CMOS 32 nm FEOL requirements. In the second time we will relax geometrical constraints to enlarge the scope of application.
继续缩小互连尺寸:这仍然是最好的解决方案吗?
根据每一代新技术CMOS ic之间的演变,ITRS建议将互连尺寸减小约为根号2的因数。本文提出了一种基于CMOS 45纳米节点的完美控制技术的参考设计规则,其互连宽度等于其分离空间。我们的研究重点是减小互连空间或宽度对信号传输速度和延迟的影响。为了避免新的工业制造对成本和可靠性的限制,本研究在不改变CMOS 45纳米集成电路BEOL中使用的工艺和材料的情况下进行。我们将研究50纳米宽度的互连,根据CMOS 32纳米FEOL要求,线间距为50纳米。第二次我们将放宽几何约束,扩大应用范围。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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