Soldering and interfacial characteristics of Sn-3.5Ag solder containing zinc nanoparticles

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 1900-01-01 DOI:10.1109/IEMT.2012.6521748

Y. M. Leong, A. Haseeb

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Abstract

Driven by the necessity to improve the reliability of lead free electronic products and by the trend towards miniaturization, researchers are putting intense efforts to improve the properties of Sn based solders. One of the current approaches to improve the properties of Sn based solder is to add nanoparticles. A number of studies have been done on the effects of the addition of nanoparticles on the interfacial intermetallic compound (IMC) characteristics [1-3]. It has been found that the additions of Ni [1], Co [1,2] and Mo [3] nanoparticles substantially influence the characteristics of interfacial intermetallic compounds.The present work investigates the effects of Zn nanoparticles (up to 0.34%) on the melting point, wetting characteristics and interfacial structure between Sn-3.5Ag (SA) solder and copper substrate during reflow. The melting characteristics of nanocomposite solders were investigated by differential scanning calorimetry (DSC). The actual Zn content of the solder after reflow was determined by Inductively Coupled Plasma-Optical Emission Spectrometry (ICP-OES). The wetting angle and spreading rate were measured to investigate the solderability of nancomposite solder. High resolution field emission scanning electron microscopy (FESEM) was used to investigate the morphology of IMC formation at the solder/substrate interface during reflow. Results showed that addition of Zn nanoparticles suppressed the melting point of the solder. The wetting angle of the solder increased, while the spreading rate decreased with the addition of Zn nanoparticles. Cross sectional microscopy revealed that the typical scallop type Cu6Sn5 and a very thin, flat Cu3Sn formed in SA after 1x and 6x reflows. The addition of Zn nanoparticles substantially suppressed the growth of the interfacial IMCs. Addition of Zn has also suppresed the formation of Cu3Sn significantly during aging. The mechanism of the influence of Zn nanoparticles is discussed.

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含锌纳米粒子Sn-3.5Ag焊料的焊接及界面特性

在提高无铅电子产品可靠性的必要性和小型化趋势的推动下，研究人员正在努力提高锡基焊料的性能。目前改善锡基焊料性能的方法之一是添加纳米颗粒。许多研究已经完成了纳米颗粒的加入对界面金属间化合物(IMC)特性的影响[1-3]。研究发现，Ni[1]、Co[1,2]和Mo[3]纳米颗粒的加入对界面金属间化合物的特性有很大影响。研究了锌纳米颗粒(0.34%)对回流过程中Sn-3.5Ag (SA)焊料与铜衬底之间的熔点、润湿特性和界面结构的影响。采用差示扫描量热法(DSC)研究了纳米复合钎料的熔化特性。采用电感耦合等离子体发射光谱法(ICP-OES)测定回流后焊料的实际锌含量。测定了纳米复合钎料的润湿角和涂敷速率，研究了其可焊性。采用高分辨率场发射扫描电镜(FESEM)研究了回流过程中焊料/衬底界面上IMC形成的形貌。结果表明，锌纳米粒子的加入抑制了焊料的熔点。随着锌纳米粒子的加入，钎料的润湿角增大，铺展速率降低。横断面显微镜显示，经过1x和6x回流，SA中形成了典型的扇贝型Cu6Sn5和极薄的扁平Cu3Sn。锌纳米粒子的加入抑制了界面IMCs的生长。在时效过程中，添加Zn也显著抑制了Cu3Sn的形成。讨论了纳米锌的影响机理。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

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