Extreme high pressure and high temperature package development

How Yuan Hwang, Eva Wai Leong Ching, C. Sing, V. Chidambaram, Lee Jong Bum, E. Rong, Gan Chee Lip, Daniel Rhee Min Woo
{"title":"Extreme high pressure and high temperature package development","authors":"How Yuan Hwang, Eva Wai Leong Ching, C. Sing, V. Chidambaram, Lee Jong Bum, E. Rong, Gan Chee Lip, Daniel Rhee Min Woo","doi":"10.1109/EPTC.2013.6745746","DOIUrl":null,"url":null,"abstract":"As oil and gas industries ventured further and deeper into the earth or ocean in search for new reservoirs, the requirements of depth, pressure and temperature are ever expanding. Conventionally, ceramic based hermetic sealed packaging is used for high temperature endurable package. However, for the case of highly pressurized application, the stress on the package is substantial and the hermetically sealed ceramic package cannot survive under a high pressure up to 30kpsi. To overcome this limitation, the authors are proposing to fill high temperature and high pressure endurable protective materials inside of ceramic substrate cavity to absorb the package internal stress caused by the external high pressure loading. The reliability of the package has been successfully demonstrated under combined 30kpsi isostatic pressure and 300°C temperature (HPHT) aging condition for 500 hours as well as thermal cycling condition for 500 cycles.","PeriodicalId":210691,"journal":{"name":"2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)","volume":"85 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2013.6745746","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

As oil and gas industries ventured further and deeper into the earth or ocean in search for new reservoirs, the requirements of depth, pressure and temperature are ever expanding. Conventionally, ceramic based hermetic sealed packaging is used for high temperature endurable package. However, for the case of highly pressurized application, the stress on the package is substantial and the hermetically sealed ceramic package cannot survive under a high pressure up to 30kpsi. To overcome this limitation, the authors are proposing to fill high temperature and high pressure endurable protective materials inside of ceramic substrate cavity to absorb the package internal stress caused by the external high pressure loading. The reliability of the package has been successfully demonstrated under combined 30kpsi isostatic pressure and 300°C temperature (HPHT) aging condition for 500 hours as well as thermal cycling condition for 500 cycles.
极高压和高温封装开发
随着油气行业不断深入到地球或海洋中寻找新的储层,对深度、压力和温度的要求也在不断提高。传统上,陶瓷基密封包装用于耐高温包装。然而,在高压应用的情况下,封装上的应力是巨大的,密封陶瓷封装无法在高达30kpsi的高压下存活。为了克服这一限制,作者提出在陶瓷基板腔内填充耐高温高压保护材料,以吸收外部高压载荷引起的封装内应力。在30kpsi等静压和300℃高温(HPHT)老化500小时以及热循环500次条件下,该封装的可靠性已成功验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信