{"title":"Reliability Study of a High-Precision Thick Film Resistor Network","authors":"Y. Nakada, T. L. Schock","doi":"10.1109/TPHP.1977.1135207","DOIUrl":null,"url":null,"abstract":"This investigation was undertaken to determine the reliability of a thick film resistor network, comprised of 4 matched 1.1 M \\Omega resistors. The objectives of the program were: 1) to define any potential failure mechanism and 2) to determine the end-of-life (20 years) resistot properties. These objectives were achieved by a simulated life-testing of the resistor networks through the use of accelerated aging tests in various environments. Four resistor network properties were measured in this study: 1) resistance of individual resistor; 2) bridge imbalance voltage; 3) resistor noise; and 4) temperature coefficient of resistance. Evaluation of the data obtained in the present investigation resulted in the following conclusions. l)There is no potential failure mechanism that will cause the resistor network to degrade outside its end-of-life requirements during its lifetime. 2) The extrapolation of the high-temperature aging data to maximum operating temperature (70°C) indicates that the resistance value will not increase more than 0.5 percent in 20 years. 3) Other properties such as noise, stability against lightning surge, and temperature coefficient of resistance were insensitive to any aging treatments.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1977-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Parts, Hybrids, and Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TPHP.1977.1135207","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
This investigation was undertaken to determine the reliability of a thick film resistor network, comprised of 4 matched 1.1 M \Omega resistors. The objectives of the program were: 1) to define any potential failure mechanism and 2) to determine the end-of-life (20 years) resistot properties. These objectives were achieved by a simulated life-testing of the resistor networks through the use of accelerated aging tests in various environments. Four resistor network properties were measured in this study: 1) resistance of individual resistor; 2) bridge imbalance voltage; 3) resistor noise; and 4) temperature coefficient of resistance. Evaluation of the data obtained in the present investigation resulted in the following conclusions. l)There is no potential failure mechanism that will cause the resistor network to degrade outside its end-of-life requirements during its lifetime. 2) The extrapolation of the high-temperature aging data to maximum operating temperature (70°C) indicates that the resistance value will not increase more than 0.5 percent in 20 years. 3) Other properties such as noise, stability against lightning surge, and temperature coefficient of resistance were insensitive to any aging treatments.
这项研究是为了确定由4个匹配的1.1 M ω电阻组成的厚膜电阻网络的可靠性。该计划的目标是:1)确定任何潜在的失效机制,2)确定寿命结束(20年)的电阻特性。这些目标是通过在各种环境中使用加速老化试验对电阻网络进行模拟寿命试验来实现的。本研究测量了四个电阻器网络特性:1)单个电阻器的电阻;2)电桥电压不平衡;3)电阻噪声;4)电阻温度系数。对本调查中获得的数据进行评估后得出以下结论。l)在其使用寿命期间,不存在导致电阻器网络在其寿命终止要求之外降级的潜在失效机制。2)高温老化数据外推到最高工作温度(70℃),表明电阻值在20年内不会增加超过0.5%。3)其他性能如噪声、抗雷击浪涌稳定性和电阻温度系数对任何老化处理都不敏感。