{"title":"Beyond scaling - teaching the old dog some new tricks [Semiconductor technology]","authors":"S. Iyer","doi":"10.1109/IPFA.2007.4378071","DOIUrl":null,"url":null,"abstract":"While the semiconductor industry has been focused on the challenges of scaling, it has become quite apparent that one must take a broader view of delivering productivity and performance gains in this new regime of non- classical scaling. While transistor level and interconnect performance will continue to make strides through the innovative use of stress engineering, novel materials such as high k dielectrics in the front end and low k dielectrics and high conductivity interconnects in the backend, there is much more to be gained by addressing the issues of memory integration, on- chip decoupling and autonomic chip functions.","PeriodicalId":334987,"journal":{"name":"2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"5 3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2007.4378071","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
While the semiconductor industry has been focused on the challenges of scaling, it has become quite apparent that one must take a broader view of delivering productivity and performance gains in this new regime of non- classical scaling. While transistor level and interconnect performance will continue to make strides through the innovative use of stress engineering, novel materials such as high k dielectrics in the front end and low k dielectrics and high conductivity interconnects in the backend, there is much more to be gained by addressing the issues of memory integration, on- chip decoupling and autonomic chip functions.