Near-field wireless connection for 3D-system integration

T. Kuroda
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引用次数: 2

Abstract

This paper describes a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI). TCI is a digital CMOS circuit solution in a standard CMOS technology. It is less expensive than TSV but bears comparison in performance.
用于3d系统集成的近场无线连接
本文介绍了一种采用电感耦合的无线芯片间链路,即ThruChip接口(TCI)。TCI是标准CMOS技术中的数字CMOS电路解决方案。它比TSV便宜,但在性能上可以比较。
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