M.-H. Lin, P. Bradley, H. Wu, J. Booth, R. Radebaugh, Y.C. Lee
{"title":"Design, fabrication, and assembly of a hollow-core fiber-based micro cryogenic cooler","authors":"M.-H. Lin, P. Bradley, H. Wu, J. Booth, R. Radebaugh, Y.C. Lee","doi":"10.1109/SENSOR.2009.5285925","DOIUrl":null,"url":null,"abstract":"One of the smallest Joule Thomson (J-T) micro cryogenic coolers (MCC) utilizing a hollow-core fiber-based heat exchanger (HX) is designed, fabricated, assembled and tested. Techniques that control mask material etching are developed to fabricate a multi-layer silicon structure on HX-coupling manifolds. A segmental metal coating is applied on the fibers and the capillary for solderable areas and reduced radiation and conduction heat transfer. With 16∶1 pressure ratio mixed refrigerants, a 140 K stable temperature and 76 K transient temperature at cold head are demonstrated.","PeriodicalId":247826,"journal":{"name":"TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SENSOR.2009.5285925","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 16
Abstract
One of the smallest Joule Thomson (J-T) micro cryogenic coolers (MCC) utilizing a hollow-core fiber-based heat exchanger (HX) is designed, fabricated, assembled and tested. Techniques that control mask material etching are developed to fabricate a multi-layer silicon structure on HX-coupling manifolds. A segmental metal coating is applied on the fibers and the capillary for solderable areas and reduced radiation and conduction heat transfer. With 16∶1 pressure ratio mixed refrigerants, a 140 K stable temperature and 76 K transient temperature at cold head are demonstrated.