Comprehensive Warpage Analysis of Stacked Die MEMS Package in Accelerometer Application

Abstract

Packaging of MEMS (micro-electro-mechanical system) devices poses more challenges than conventional TC packaging, since the performance of the MEMS devices is highly dependent on packaging processes. A land grid array (LGA) package is introduced for MEMS technology based linear multi-axis accelerometers. Finite element modeling is conducted to simulate the warpage behavior of the LGA packages. A method to correlate the package warpage to matrix block warpage has been developed. Warpage for both package and sensor substrate are obtained. Warpage predicted by simulation correlates very well with experimental measurements. Based on this validated method, detailed design analysis with different package geometrical variations are carried out to optimize the package design. With the optimized package structure, the packaging effect on accelerometer signal performance is well controlled