Robustness and reliability achievements for direct hybrid bonding integration: a review

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2019-05-21 DOI:10.23919/LTB-3D.2019.8735353

S. Moreau, J. Jourdon, S. Lhostis, D. Bouchu, Y. Henrion, L. Arnaud, A. Jouve, V. Balan, F. Fournel, P. Lamontagne, S. Chéramy, L. Cioccio

引用次数: 2

Abstract

The paper reviews the robustness/reliability achievements and include previously published data related to the hybrid bonding module for W2W and D2W bonding techniques.

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直接混合键合集成的鲁棒性和可靠性研究进展

本文回顾了鲁棒性/可靠性方面的成就，并包括先前发表的与W2W和D2W键合技术的混合键合模块相关的数据。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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