Increasing package robustness with palladium coated copper wire

Abstract

Alternative solutions to gold wire are being sought as a for lower cost packages. Palladium coated copper (PCC) wires serve as a potential alternative to increase package robustness and lower package cost particularly in the automotive industry. Palladium on the surface of the wire promotes better adhesion of the wire to the surface where it is bonded. In effect, this may result to elimination of broken wire at heel and lifted ball. This paper discusses the material considerations involved in shifting to PCC wire. In this paper, the benefits of coating bare Cu wire with Pd are discussed. These improvements include enhancements in material properties, wirebond responses, intermetallic compound (IMC) formation and reliability that Pd coating imparts on Cu wire. Palladium coating on Cu wire results to better first and second bond reliability hence, improving package robustness.