High-mobility and low-parasitic resistance characteristics in strained Ge nanowire pMOSFETs with metal source/drain structure formed by doping-free processes

K. Ikeda, M. Ono, D. Kosemura, K. Usuda, M. Oda, Y. Kamimuta, T. Irisawa, Y. Moriyama, A. Ogura, T. Tezuka
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引用次数: 19

Abstract

Metal source/drain (S/D) Ge nanowire MOSFETs with a compressive strain as high as 3.8% were fabricated by the 2-step Ge-condensation technique without intentional doping for the S/D. Record high inversion hole mobility (μeff = 855 cm2/Vs @ Ns = 5×1012cm-2) and saturation drain current 731μA/μm at Vd=-1V were achieved among Ge nanowire pFETs ever reported. It is found that the extremely low contact resistivity ρc ~ 4×10-8O cm2 for the Schottky contact contributes to the high saturation current as well as the high mobility.
无掺杂制备金属源极/漏极应变锗纳米线pmosfet的高迁移率和低寄生电阻特性
采用两步Ge缩合技术制备了压缩应变高达3.8%的金属源/漏极(S/D) Ge纳米线mosfet。在Vd=-1V时,锗纳米线pfet获得了前所未有的高反转空穴迁移率(μeff = 855 cm2/Vs @ Ns = 5×1012cm-2)和731μA/μm的饱和漏极电流。发现肖特基触点极低的接触电阻率ρc ~ 4×10-8O cm2有助于高饱和电流和高迁移率。
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