MicroLens/UV-LED array packaging for dynamic and static alignment

M. Luetzelschwab, M. Desmulliez, D. Weiland
{"title":"MicroLens/UV-LED array packaging for dynamic and static alignment","authors":"M. Luetzelschwab, M. Desmulliez, D. Weiland","doi":"10.1109/ESTC.2008.4684509","DOIUrl":null,"url":null,"abstract":"This paper presents a fully integrated packaging solution that permits the static and active alignment of a microLens array placed on top of a micro-UV-LED array. The entire process is manufactured by UV-lithography using predominantly the photoresists SU8 and THB. The processing temperature for all steps is below 120degC.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 2nd Electronics System-Integration Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2008.4684509","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

This paper presents a fully integrated packaging solution that permits the static and active alignment of a microLens array placed on top of a micro-UV-LED array. The entire process is manufactured by UV-lithography using predominantly the photoresists SU8 and THB. The processing temperature for all steps is below 120degC.
MicroLens/UV-LED阵列封装,用于动态和静态校准
本文提出了一种完全集成的封装解决方案,允许放置在微型uv - led阵列顶部的微透镜阵列的静态和主动对齐。整个过程是通过uv光刻制造的,主要使用光刻剂SU8和THB。所有步骤的加工温度都在120℃以下。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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