Low stress and high thermal conductive underfill for cu/low-k application

Abstract

SiC particles and epoxy resin were applied to prepare a potential high thermal conductivity underfill material. SiC particles are thermally coated with a nano layer silica by oxidation at high temperature. Then silane was used as the surface treatment of the silica coated SiC particles to improve the interaction between filler and polymer matrix. TEM and TGA measurements were used to characterize the treated SiC particles. Mechanical properties of the epoxy composite with the treated SiC filler were measured by DMA, TMA and die shear adhesion test. This study also focused on optimizing the thermal conductivity of the polymer composites by filler surface pretreatment to increase interfacial bonding and decrease the thermal resistance.