Modeling and design of system-in-package integrated voltage regulator with thermal effects

Abstract

This paper demonstrates a new approach to model the impact of thermal effects on the efficiency of integrated voltage regulators (IVRs) by combining analytical efficiency evaluations with coupled electrical and thermal simulations. An application of the approach shows that a system-in-package solution avoids thermal problems typically observed in other IVR designs. While the evaluation in this paper focuses on the thermal impact on loss in the inductor wiring and the PDN, the developed approach is general enough to also model thermal impacts on the power dissipation in the inductor cores and the buck converter chip.