{"title":"One mask nickel micro-fabricated reed relay","authors":"S. Roth, C. Marxer, G. Feusier, N. D. de Rooij","doi":"10.1109/MEMSYS.2000.838512","DOIUrl":null,"url":null,"abstract":"This paper reports on the fabrication and experimental results of a reed relay for end-course detection application. The end-course is detected by approaching an external magnet near the device. Nickel material has been chosen for the realisation of the device because of its good magnetic properties and its ability to be electrodeposited. The fabrication process requires a single photolithography step. The relay has been fabricated using a 55 /spl mu/m thick positive resist photopatterning process developed in our laboratory. Electrical, static and dynamic characterisations have been performed. The final chip dimensions are 3 mm long, 1 mm wide and 0.4 mm thick.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.2000.838512","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
This paper reports on the fabrication and experimental results of a reed relay for end-course detection application. The end-course is detected by approaching an external magnet near the device. Nickel material has been chosen for the realisation of the device because of its good magnetic properties and its ability to be electrodeposited. The fabrication process requires a single photolithography step. The relay has been fabricated using a 55 /spl mu/m thick positive resist photopatterning process developed in our laboratory. Electrical, static and dynamic characterisations have been performed. The final chip dimensions are 3 mm long, 1 mm wide and 0.4 mm thick.