{"title":"Implication And Solutions For Joule Heating In High Performance Interconnects Incorporating Low-k Dielectrics","authors":"Shih, Chang, Havemann, Levine","doi":"10.1109/VLSIT.1997.623706","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":414778,"journal":{"name":"1997 Symposium on VLSI Technology","volume":"220 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-06-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 Symposium on VLSI Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.1997.623706","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
