The role of laminate, LTCC, and silicon based approaches to system in package development

Abstract

As the wireless industry continues to advance, demand for further system miniaturization, cost reduction, improved performance, and reliability are increasing. Several new substrate technology solutions have shown the potential to successfully integrate the passive components. Each of these solutions has advantages, disadvantages, and limitations. A Power Amplifier (PA) case study was conducted to compare the benefits and drawbacks between the laminate, ceramic and high resistivity silicon substrates.