Variability aware performance evaluation of low power SRAM cell

H. Dsilva, J. Pinto, Arzan Elchidana, S. Mande
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引用次数: 2

Abstract

Till today CMOS scaling is considered as the best option to achieve higher density, high performance and low power integrated circuits. However, scaling of conventional planar MOSFET in the sub-45nm regime leads to many undesirable short channel effects. FinFET is considered as the suitable candidate for the replacement of conventional planar MOSFETs. In this work, suitability of FinFETs for replacement of planar bulk technology in sub-20nm regime has been verified using Predictive Technology Models. For this purpose, the performance of the FinFET based SRAM cell is compared with conventional planar Bulk based SRAM cell. Moreover, robustness of FinFET based SRAM cell against process, temperature and power supply variations is evaluated and compared with conventional planar based SRAM cell. Our simulation results confirms the suitability of FinFETs for the replacement of conventional planar CMOS technology.
低功耗SRAM单元可变性感知性能评估
直到今天,CMOS缩放被认为是实现更高密度,高性能和低功耗集成电路的最佳选择。然而,传统的平面MOSFET在sub-45nm范围内的缩放会导致许多不良的短沟道效应。FinFET被认为是替代传统平面mosfet的合适人选。在这项工作中,使用预测技术模型验证了finfet在亚20nm范围内取代平面体技术的适用性。为此,将基于FinFET的SRAM单元的性能与传统的平面Bulk SRAM单元进行了比较。此外,还评估了基于FinFET的SRAM电池对工艺、温度和电源变化的鲁棒性,并与传统的基于平面的SRAM电池进行了比较。我们的仿真结果证实了finfet取代传统平面CMOS技术的适用性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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