Effect of contamination on copper migration in TAB tape structures

Proceedings of 1994 IEEE International Reliability Physics Symposium Pub Date : 1994-04-11 DOI:10.1109/RELPHY.1994.307852

D. Nieman

引用次数: 13

Abstract

Copper migration in adhesive of Tape Automated Bonding (TAB) tape during biased moisture stress can cause failure. Experiments aimed at reducing copper migration show that copper precipitation lengths after HAST are linearly proportional to chloride concentration in the TAB tape material. Discharge potential measurements of TAB tape in 156 /spl deg/C bake are correlated to chloride concentration.<>

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污染对TAB带结构中铜迁移的影响

自动粘接(TAB)胶带在偏湿应力下的铜迁移会导致失效。旨在减少铜迁移的实验表明，HAST后的铜沉淀长度与TAB带材料中的氯化物浓度成线性正比。156 /spl℃高温下TAB带放电电位测量值与氯离子浓度相关

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Proceedings of 1994 IEEE International Reliability Physics Symposium

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