Impact of three-dimensional current flow on accurate TCAD simulation for trench-gate IGBTs

Masahiro Watanabe, N. Shigyo, T. Hoshii, K. Furukawa, K. Kakushima, K. Satoh, T. Matsudai, T. Saraya, T. Takakura, K. Itou, M. Fukui, S. Suzuki, K. Takeuchi, I. Muneta, H. Wakabayashi, A. Nakajima, S. Nishizawa, K. Tsutsui, T. Hiramoto, H. Ohashi, H. Iwai
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引用次数: 4

Abstract

TCAD simulation has been recognized as a powerful design tool for insulated gate bipolar transistors (IGBTs). In this work, excellent agreement between 3D TCAD simulations and experimental current-voltage characteristics were obtained in the up to 1000 A/cm2 region for IGBTs with scaled trench-gates. The results of 2D and 3D simulations are compared to discuss the difference in current-voltage characteristics and their physical origins. A method to evaluate the saturation current ($\boldsymbol{J}_{\mathbf{Csat}}$) using a 2D simulation is also presented with an appropriate correction.
三维电流对沟栅igbt精确TCAD仿真的影响
TCAD仿真已被公认为是绝缘栅双极晶体管(igbt)的强大设计工具。在这项工作中,在高达1000 A/cm2的范围内,具有缩放沟栅的igbt的3D TCAD模拟和实验电流-电压特性之间获得了非常好的一致性。对二维和三维仿真结果进行了比较,讨论了电流-电压特性的差异及其物理根源。本文还提出了一种利用二维仿真计算饱和电流($\boldsymbol{J}_{\mathbf{Csat}}$)的方法,并进行了适当的校正。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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